The global embedded die packaging technology market size was valued at $63.93 million in 2020 and is projected to reach $311.41 million by 2030, registering a CAGR of 18.2% from 2021 to 2030. Embedded die packaging technology refers to embedding the die directly into printed circuit board (PCB) laminated substrate, which facilitates size reduction, power saving, and improves the overall efficiency of the system on a large scale.
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